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Industry Information
Application of X-Ray inspection instrument in PCBA board quality inspection
2024-08-06

In order to ensure the production quality of PCBA board, the manufacturer has undergone a variety of inspection methods in the production process,

 each

 inspection method will target at different methods of PCBA board defects. Can be divided into visual testing method and electrical testing method two

 categories,


Common checking methods for PCBA are as follows:

In order to ensure the production quality of PCBA board, the manufacturer has undergone a variety of inspection methods in the production process, each inspection 

method will target at different methods of PCBA board defects. Can be divided into visual testing method and electrical testing method two categories,


Common checking methods for PCBA are as follows:


1. Manual visual inspection: Use a magnifying glass or calibrated microscope visual inspection operator to determine whether the board is compliant and when to calibrate 

the operation. This is the most traditional method of examination. Its main disadvantages are subjective human error, high long-term cost, discontinuous defect detection, 

and difficult data collection. At present, this method is becoming less feasible due to improvements in PCBA manufacturing and PCBA.


2. Automatic optical inspection is also known as automatic appearance inspection. It is based on optical principles and utilizes various technologies (such as image analysis, 

computers and automatic control) to detect and deal with defects encountered in production. The disadvantage is that this method does not detect covered spot welding 

or internal defects.




Automatic X-ray inspection uses differences in different substances in X-ray absorption to check for parts and defects to be checked. It is mainly used to check defects such

 as extremely fine spacing, extremely high density circuit boards, Bridges, missing parts, and poor alignment in the assembly process. It can also use its tomographic 

imaging technology to detect internal defects in IC chips. This is the only way to test the quality of the ball grid array and the welding ball.


The above is the relevant introduction of the application of X-Ray inspection equipment in PCBA board quality inspection. I hope to help you



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